The Compal picoNode is an innovative ultra-small, power-saving RPMA module for IoT and M2M applications.
The picoNode easily integrates with a micro-controller or applications processor using a serial peripheral interface (SPI). The printed circuit board is enclosed with a radio frequency (RF) shield. The picoNode is an LGA-style module designed to be soldered directly onto a host board.
Features & Benefits:
COMPANY Compal
COUNTRY Taiwan
TYPE Module & Device Manufacturer
WEBSITE www.compal.com
CONTACT mailto:info@compal.com